| 7:45AM-8:30AM |
Breakfast/Registration
|
|
| 8:30AM-10:35AM |
Tutorial 1: AI Assisted Hardware Design - Will AI Elevate or Replace Hardware Engineers?
Chair: Bryan Chin, UCSD |
|
| |
Introduction
|
Bryan Chin, UCSD |
| |
Introduction to AI for Chip Design
|
Mark Ren, NVIDIA |
| |
AI Driven Optimization
|
Stelios Diamantidis, Synopsys |
| |
LLM and Chip Design
|
Hans Bouwmeester, PrimisAI |
| 10:35AM-11:00AM |
Coffee Break (1/2 hr)
|
|
| 11:00AM-12:30PM |
Tutorial 1: AI Assisted Hardware Design - Will AI Elevate or Replace Hardware Engineers?
Chair: Bryan Chin, UCSD |
|
| |
Domain Adaptive LLM Models
|
Hanxian Huang, UCSD |
| |
LLM Agents for Chip Design
|
Mark Ren, NVIDIA |
| |
Future Directions & Panel Discussion
|
|
| 12:30PM-1:45PM |
Lunch (1 hr 15 min)
|
|
| 1:45PM-3:15PM |
Tutorial 2: The Cooling of Hot Chips: How thermal technology is keeping up with the AI revolution
Chair: Seshu Madhavapeddy, Frore Systems |
|
| |
Thermal techniques for higher data center compute density
|
Tom Garvens, Supermicro |
| |
Next-generation cooling for NVIDIA’s Accelerated Computing
|
Ali Heydari, NVIDIA |
| 3:15PM-3:45PM |
Coffee Break (1/2 hr)
|
|
| 3:45PM-6:00PM |
Tutorial 2: The Cooling of Hot Chips: How thermal technology is keeping up with the AI revolution
Chair: Seshu Madhavapeddy, Frore Systems |
|
| |
Thermal challenges of Edge Devices
|
Nader Nikfar, Qualcomm |
| |
Solid-state active cooling helps maintain Moore’s Law
|
Prabhu Sathyamurthy, Frore Systems |
| |
Applications for thermo-electric cooling
|
Jesse Edwards, Phononic |
| 6:00PM-8:00PM |
Reception
|
|